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Sockets and microelectronic packages
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CPU socket
TE Connectivity offers a wide variety of processor sockets that are ideal for use with Intel and...
CPU socket
TE Connectivity offers a wide variety of processor sockets that are ideal for use with Intel and AMD-based microprocessor packages. The different kinds of sockets include PGA, Micro PGA, and LGA with little to zero insertion force. The PGA Sockets (LIF) is specifically utilized for microprocessor package test applications utilizing through hole solder attach to the PCB design.
Ceramic substrate
CoorsTek Thin-Film Ceramic Substrates are specifically designed for superior surface finish characteristics. The substrates are of high purity and have a thin film which provides these next-generation electronic...
Ceramic substrate
CoorsTek Thin-Film Ceramic Substrates are specifically designed for superior surface finish characteristics. The substrates are of high purity and have a thin film which provides these next-generation electronic...
Epoxy seal lid for encapsulation packages
CoorsTek provides you with high quality epoxy seal lids for electronic packages, backed with over 100 years of solid experience....
Epoxy seal lid for encapsulation packages
CoorsTek provides you with high quality epoxy seal lids for electronic packages, backed with over 100 years of solid experience. Our Epoxy Seal 806 (ES-806) and ceramic enclosures can be customized and combined to meet your electronic packaging requirements for your fragile and sensitive electronic devices. Once sealed, the enclosures are moisture resistant, protecting your devices at competitive costs, a proven alternative to brazed, soldered, or glass-sealed lids.
PGA socket - cLGA®
The Amphenol InterCon cLGA® land grid array socket system offers traditional-connector-component...
PGA socket - cLGA®
The Amphenol InterCon cLGA® land grid array socket system offers traditional-connector-component...